Heat gets evenly spread across the phone, proving it is dissipating effectively unlike before. Try applying Artic Mx4 onto the processor and the NAND memory on the side you will notice a difference. The solution lies in replacing the thermal paste. Upon opening the phone, users would notice the thermal paste, hidden beneath a copper sheet that doesn't contact the chassis. It's such a pity this occurs, especially when compared to the performance of gaming phones with the same processors that outperform others in heat management. To make things worse, they use substandard thermal compounds. Cooling plates fail to make perfect contact with the processor and memory, causing an overheating that subsequently degrades its performance. The real issue lies with the phone manufacturer's inadequate cooling system. The claim that the chip is not optimized is inaccurately made. Lastly, it seems like the Mali G720 Immortalis MP12 might match or even exceed the speed of the Adreno 750 in the Snapdragon 8 Gen 3 SoC. Rumor also has it that phones powered by the Dimensity 9300 could score more than 2.24 in Antutu. Moreover, it would be logical for Original Equipment Manufacturers (OEMs) to opt for the Dimensity 9300 SoC if its power consumption is indeed 50% lower than the Dimensity 9200. Consequently, the MediaTek Dimensity 9300 will likely be a more cost-effective option than the Snapdragon 8 Gen 3 SoC. In addition, the Vivo X100 Pro reportedly achieved scores above 2,240,000 in Antutu, outperforming even the highest score of a Snapdragon 8 Gen 3-powered Realme phone. Therefore, I might consider a phone powered by the Dimensity 9300, if MediaTek's assertion holds true. While the power consumption may not be exactly halved, it seems certain that the Dimensity 9300 will consume significantly less power than the Dimensity 9200, contrary to popular claims that it might overheat. MediaTek posits that the power efficiency of the Dimensity 9300 is 50% lower than the Dimensity 9200, although it's unclear how this is achieved.
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